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Conductive inks for metalization in integrated polymer microsystems

United States Patent

February 28, 2006
View the Complete Patent at the US Patent & Trademark Office
Lawrence Livermore National Laboratory - Visit the Industrial Partnerships Office Website
A system of metalization in an integrated polymer microsystem. A flexible polymer substrate is provided and conductive ink is applied to the substrate. In one embodiment the flexible polymer substrate is silicone. In another embodiment the flexible polymer substrate comprises poly(dimethylsiloxane).
Davidson; James Courtney (Livermore, CA), Krulevitch; Peter A. (Pleasanton, CA), Maghribi; Mariam N. (Livermore, CA), Benett; William J. (Livermore, CA), Hamilton; Julie K. (Tracy, CA), Tovar; Armando R. (San Antonio, TX)
The Regents of the University of California (Oakland, CA)
10/ 371,912
February 20, 2003
The United States Government has rights in this invention pursuant to Contract No. W-7405-ENG-48 between the United States Department of Energy and the University of California for the operation of Lawrence Livermore National Laboratory.