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Cascaded die mountings with spring-loaded contact-bond options

United States Patent

August 16, 2005
View the Complete Patent at the US Patent & Trademark Office
Oak Ridge National Laboratory - Visit the Partnerships Directorate Website
A cascaded die mounting device and method using spring contacts for die attachment, with or without metallic bonds between the contacts and the dies, is disclosed. One embodiment is for the direct refrigerant cooling of an inverter/converter carrying higher power levels than most of the low power circuits previously taught, and does not require using a heat sink.
Hsu; John S. (Oak Ridge, TN), Adams; Donald J. (Knoxville, TN), Su; Gui-Jia (Knoxville, TN), Marlino; Laura D. (Oak Ridge, TN), Ayers; Curtis W. (Kingston, TN), Coomer; Chester (Knoxville, TN)
UT-Battelle, LLC (Oak Ridge, TN)
10/ 738,746
December 17, 2003
STATEMENT REGARDING FEDERAL SPONSORSHIP This invention was made with Government support under contract no. DE-AC05-00OR22725 to UT-Battelle, LLC, awarded by the United States Department of Energy. The Government has certain rights in the invention.