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Cooled electrical terminal assembly and device incorporating same

United States Patent

May 24, 2005
View the Complete Patent at the US Patent & Trademark Office
A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
Beihoff; Bruce C. (Wauwatosa, WI), Radosevich; Lawrence D. (Muskego, WI), Phillips; Mark G. (Brookfield, WI), Kehl; Dennis L. (Milwaukee, WI), Kaishian; Steven C. (Milwaukee, WI), Kannenberg; Daniel G. (Waukesha, WI)
Rockwell Automation Technologies, Inc. (Mayfield Heights, OH)
10/ 252,183
December 23, 2002
GOVERNMENT LICENSE RIGHTS This invention was made with Government support under Cooperative Agreement No. DE-FC02-99EE50571 awarded by the Department of Energy. The Government has certain rights in this invention.