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Parallel-plate heat pipe apparatus having a shaped wick structure

United States Patent

December 7, 2004
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
A parallel-plate heat pipe is disclosed that utilizes a plurality of evaporator regions at locations where heat sources (e.g. semiconductor chips) are to be provided. A plurality of curvilinear capillary grooves are formed on one or both major inner surfaces of the heat pipe to provide an independent flow of a liquid working fluid to the evaporator regions to optimize heat removal from different-size heat sources and to mitigate the possibility of heat-source shadowing. The parallel-plate heat pipe has applications for heat removal from high-density microelectronics and laptop computers.
Rightley; Michael J. (Albuquerque, NM), Adkins; Douglas R. (Albuquerque, NM), Mulhall; James J. (Albuquerque, NM), Robino; Charles V. (Albuquerque, NM), Reece; Mark (Albuquerque, NM), Smith; Paul M. (Albuquerque, NM), Tigges; Chris P. (Albuquerque, NM)
Sandia Corporation (Albuquerque, NM)
10/ 137,155
April 30, 2002
GOVERNMENT RIGHTS This invention was made with Government support under Contract No. DE-AC04-94AL85000 awarded by the U.S. Department of Energy. The Government has certain rights in the invention.