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Assembly of opto-electronic module with improved heat sink

United States Patent

November 23, 2004
View the Complete Patent at the US Patent & Trademark Office
A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.
Chan; Benson (Vestal, NY), Fortier; Paul Francis (Richelieu, CA), Freitag; Ladd William (Rochester, MN), Galli; Gary T. (Binghampton, NY), Guindon; Francois (Stukely-sud, CA), Johnson; Glen Walden (Yorktown Heights, NY), Letourneau; Martial (Granby, CA), Sherman; John H. (Lisle, NY), Tetreault; Real (Granby, CA)
International Business Machines Corporation (Armonk, NY)
10/ 281,036
October 24, 2002
GOVERNMENT RIGHTS This invention was made with Government support under subcontract B338307 under prime contract W-7405-END-48 awarded by the Department of Energy. The Govenment has certain rights in this invention.