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Process for fabricating a microelectromechanical structure

United States Patent

October 26, 2004
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
A process is disclosed for forming a microelectromechanical (MEM) structure on a substrate having from 5 to 6 or more layers of deposited and patterned polysilicon. The process is based on determining a radius of curvature of the substrate which is bowed due to accumulated stress in the layers of polysilicon and a sacrificial material used to buildup the MEM structure, and then providing one or more stress-compensation layers on a backside of the substrate to flatten the substrate and allow further processing.
Sniegowski; Jeffry J. (Albuquerque, NM), Krygowski; Thomas W. (Cortlandt Manon, NY), Mani; Seethambal S. (Albuquerque, NM), Habermehl; Scott D. (Corrales, NM), Hetherington; Dale L. (Albuquerque, NM), Stevens; James E. (Albuquerque, NM), Resnick; Paul J. (Albuquerque, NM), Volk; Steven R. (Albuquerque, NM)
Sandia Corporation (Albuquerque, NM)
10/ 236,631
September 5, 2002
GOVERNMENT RIGHTS This invention was made with Government support under Contract No. DE-AC04-94AL85000 awarded by the U.S. Department of Energy. The Government has certain rights in the invention.