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Apparatus and method for controlling plating uniformity

United States Patent

October 12, 2004
View the Complete Patent at the US Patent & Trademark Office
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The use of an insulating shield for improving the current distribution in an electrochemical plating bath is disclosed. Numerical analysis is used to evaluate the influence of shield shape and position on plating uniformity. Simulation results are compared to experimental data for nickel deposition from a nickel--sulfamate bath. The shield is shown to improve the average current density at a plating surface.
Hachman, Jr.; John T. (Stockton, CA), Kelly; James J. (Oakland, CA), West; Alan C. (Tenafly, NJ)
Sandia National Laboratories (Livermore, CA)
10/ 304,175
November 26, 2002
STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under government contract no. DE-AC04-94AL85000 awarded by the U.S. Department of Energy to Sandia Corporation. The Government has certain rights in the invention, including a paid-up license and the right, in limited circumstances, to require the owner of any patent issuing in this invention to license others on reasonable terms.