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Method for making electro-fluidic connections in microfluidic devices

United States Patent

August 10, 2004
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
A method for forming electro-fluidic interconnections in microfluidic devices comprises forming an electrical connection between matching bond pads on a die containing an active electrical element and a microfluidic substrate and forming a fluidic seal ring that circumscribes the active electrical element and a fluidic feedthrough. Preferably, the electrical connection and the seal ring are formed in a single bonding step. The simple method is particularly useful for chemical microanalytical systems wherein a plurality of microanalytical components, such as a chemical preconcentrator, a gas chromatography column, and a surface acoustic wave detector, are fluidically interconnected on a hybrid microfluidic substrate having electrical connection to external support electronics.
Frye-Mason; Gregory C. (Cedar Crest, NM), Martinez; David (Albuquerque, NM), Manginell; Ronald P. (Albuquerque, NM), Heller; Edwin J. (Albuquerque, NM), Chanchani; Rajen (Albuquerque, NM)
Sandia Corporation (Albuquerque, NM)
10/ 184,782
June 27, 2002
STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under contract no. DE-AC04-94AL85000 awarded by the U. S. Department of Energy to Sandia Corporation. The Government has certain rights in the invention.