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Buffer layers and articles for electronic devices

United States Patent

July 20, 2004
View the Complete Patent at the US Patent & Trademark Office
Oak Ridge National Laboratory - Visit the Partnerships Directorate Website
Materials for depositing buffer layers on biaxially textured and untextured metallic and metal oxide substrates for use in the manufacture of superconducting and other electronic articles comprise RMnO.sub.3, R.sub.1-x A.sub.x MnO.sub.3, and combinations thereof; wherein R includes an element selected from the group consisting of La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, and Y, and A includes an element selected from the group consisting of Be, Mg, Ca, Sr, Ba, and Ra.
Paranthaman; Mariappan P. (Knoxville, TN), Aytug; Tolga (Oak Ridge, TN), Christen; David K. (Oak Ridge, TN), Feenstra; Roeland (Knoxville, TN), Goyal; Amit (Knoxville, TN)
UT-Battelle, LLC (Oak Ridge, TN)
10/ 324,883
December 19, 2002
This invention was made with Government support under Contract No. DE-AC05-00OR22725 awarded by the United States Department of Energy. The Government has certain rights in the invention.