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Enhanced adhesion for LIGA microfabrication by using a buffer layer

United States Patent

January 27, 2004
View the Complete Patent at the US Patent & Trademark Office
Argonne National Laboratory - Visit the Technology Development and Commercialization Website
The present invention is an improvement on the LIGA microfabrication process wherein a buffer layer is applied to the upper or working surface of a substrate prior to the placement of a resist onto the surface of the substrate. The buffer layer is made from an inert low-Z material (low atomic weight), a material that absorbs secondary X-rays emissions from the substrate that are generated from the substrate upon exposure to a primary X-rays source. Suitable materials for the buffer layer include polyamides and polyimide. The preferred polyimide is synthesized form pyromellitic anhydride and oxydianiline (PMDA-ODA).
Bajikar; Sateesh S. (San Jose, CA), De Carlo; Francesco (Darien, IL), Song; Joshua J. (Naperville, IL)
The United States of America as represented by the United States Department of Energy (Washington, DC)
09/ 925,369
August 10, 2001
The United States Government has rights in this invention pursuant to Contract No. W-31-109-Eng-38 between the U.S. Department of Energy and the University of Chicago representing Argonne National Laboratory.