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Processing a printed wiring board by single bath electrodeposition

United States Patent

6,547,946
April 15, 2003
View the Complete Patent at the US Patent & Trademark Office
Lawrence Livermore National Laboratory - Visit the Industrial Partnerships Office Website
A method of processing a printed wiring board by single bath electrodeposition. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from the bath containing nickel and copper and final processing steps are implemented on the printed wiring board.
Meltzer; Michael P. (Oakland, CA), Steffani; Christopher P. (Livermore, CA), Gonfiotti; Ray A. (Livermore, CA)
The Regents of the University of California (Oakland, CA)
09/ 810,877
20010050179
March 16, 2001
SINGLE BATH ELECTRODEPOSITION The United States Government has rights in this invention pursuant to Contract No. W-7405-ENG-48 between the United States Department of Energy and the University of California for the operation of Lawrence Livermore National Laboratory.