A method is provided for fabricating metallic microstructures, i.e., microcomponents of micron or submicron dimensions. A molding composition is prepared containing an optional binder and nanometer size (1 to 1000 nm in diameter) metallic particles. A mold, such as a lithographically patterned mold, preferably a LIGA or a negative photoresist mold, is filled with the molding composition and compressed. The resulting microstructures are then removed from the mold and the resulting metallic microstructures so provided are then sintered.
ACKNOWLEDGEMENT OF GOVERNMENT SUPPORT
The United States Government has rights in this invention pursuant to Contact No. DE-AC04-94AL85000 between the Unites States Department of Energy and Sandia Corporation for the operation of Sandia National Laboratories.