Skip to Content
Find More Like This
Return to Search

Method for making MgO buffer layers on rolled nickel or copper as superconductor substrates

United States Patent

October 22, 2002
View the Complete Patent at the US Patent & Trademark Office
Oak Ridge National Laboratory - Visit the Partnerships Directorate Website
Buffer layer architectures are epitaxially deposited on biaxially-textured rolled-Ni and/or Cu substrates for high current conductors, and more particularly buffer layer architectures such as MgO/Ag/Pt/Ni, MgO/Ag/Pd/Ni, MgO/Ag/Ni, MgO/Ag/Pd/Cu, MgO/Ag/Pt/Cu, and MgO/Ag/Cu. Techniques used to deposit these buffer layers include electron beam evaporation, thermal evaporation, rf magnetron sputtering, pulsed laser deposition, metal-organic chemical vapor deposition (MOCVD), combustion CVD, and spray pyrolysis.
Paranthaman; Mariappan (Knoxville, TN), Goyal; Amit (Knoxville, TN), Kroeger; Donald M. (Knoxville, TN), List, III; Frederic A. (Andersonville, TN)
UT-Battelle, LLC (
09/ 405,871
September 24, 1999
The United States Government has rights in this invention pursuant to contract No. DE-AC05-96OR22464 between the United States Department of Energy and Lockheed Martin Energy Research Corporation.