A micromechanical sensor and method for detecting electromagnetic radiation involve producing photoelectrons from a metal surface in contact with a semiconductor. The photoelectrons are extracted into the semiconductor, which causes photo-induced bending. The resulting bending is measured, and a signal corresponding to the measured bending is generated and processed. A plurality of individual micromechanical sensors can be arranged in a two-dimensional matrix for imaging applications.
GOVERNMENT LICENSE RIGHTS STATEMENT
This invention was made with Government support under Contract No. DE-AC05-96OR22464 awarded by the U.S. Department of Energy to Lockheed Martin Energy Research Corp., and the Government has certain rights in this invention.