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Intergranular degradation assessment via random grain boundary network analysis

United States Patent

June 4, 2002
View the Complete Patent at the US Patent & Trademark Office
Lawrence Livermore National Laboratory - Visit the Industrial Partnerships Office Website
A method is disclosed for determining the resistance of polycrystalline materials to intergranular degradation or failure (IGDF), by analyzing the random grain boundary network connectivity (RGBNC) microstructure. Analysis of the disruption of the RGBNC microstructure may be assess the effectiveness of materials processing in increasing IGDF resistance. Comparison of the RGBNC microstructures of materials exposed to extreme operating conditions to unexposed materials may be used to diagnose and predict possible onset of material failure due to
Kumar; Mukul (San Ramon, CA), Schwartz; Adam J. (Pleasanton, CA), King; Wayne E. (San Ramon, CA)
The United States of America as represented by the Department of Energy (Washington, DC)
09/ 780,089
February 9, 2001
STATEMENT OF GOVERNMENT INTEREST The United States Government has rights in this invention pursuant to Contract No. W-7405-ENG-48 between the U.S. Department of Energy and the University of California.