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Extreme-UV scanning wafer and reticle stages

United States Patent

March 5, 2002
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
A stage for precise positioning of a chuck in three orthogonal linear axes and in three orthogonal rotation axes that includes first and second subassemblies. The a first subassembly includes (i) a monolithic mirror that supports the chuck wherein the monolithic mirror has at least two polished orthogonal faces for interferometric determination of the X, Y, and .THETA.z positions; (ii) a plurality of electromagnetic actuators that control fine positioning in all six axes and coarse positioning in one axis; (iii) a position sensor for measuring the vertical Z position of the monolithic mirror; and (iv) a Lorentz actuator, that includes magnet array, for effecting motion in the Y axis. The a second subassembly comprising a stepping axis beam over which the first subassembly is suspended, wherein the stepping axis beam includes a drive coil array for the Lorentz actuator. T the stage can also include a cable stage subassembly that is positioned a fixed distance away from the monolithic mirror and/or a mechanical zero reference for the first subassembly.
Williams; Mark E. (Windham, NH)
EUV, LLC (Santa Clara, CA)
09/ 430,858
October 29, 1999
This invention was made with Government support under Contract No. DE-AC04-94AL85000 awarded by the U.S. Department of Energy to Sandia Corporation. The Government has certain rights to the invention.