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Embedded cluster metal-polymeric micro interface and process for producing the same

United States Patent

January 29, 2002
View the Complete Patent at the US Patent & Trademark Office
A micro interface between a polymeric layer and a metal layer includes isolated clusters of metal partially embedded in the polymeric layer. The exposed portion of the clusters is smaller than embedded portions, so that a cross section, taken parallel to the interface, of an exposed portion of an individual cluster is smaller than a cross section, taken parallel to the interface, of an embedded portion of the individual cluster. At least half, but not all of the height of a preferred spherical cluster is embedded. The metal layer is completed by a continuous layer of metal bonded to the exposed portions of the discontinuous clusters. The micro interface is formed by heating a polymeric layer to a temperature, near its glass transition temperature, sufficient to allow penetration of the layer by metal clusters, after isolated clusters have been deposited on the layer at lower temperatures. The layer is recooled after embedding, and a continuous metal layer is deposited upon the polymeric layer to bond with the discontinuous metal clusters.
Menezes; Marlon E. (Santa Clara, CA), Birnbaum; Howard K. (Champaign, IL), Robertson; Ian M. (Champaign, IL)
The Board of Trustees of the University of Illinois (Urbana, IL)
08/ 976,670
November 24, 1997
This invention was made with Government assistance pursuant to grant number 1-5-27114 awarded by the Department of Energy. The Government has certain rights in this invention.