A slurry system draws slurry from a slurry tank via one of several intake pipes, where each pipe has an intake opening at a different depth in the slurry. The slurry is returned to the slurry tank via a bypass pipe in order to continue the agitation of the slurry. The slurry is then diverted to a delivery pipe, which supplies slurry to a polisher. The flow of slurry in the bypass pipe is stopped in order for the slurry in the slurry tank to begin to settle. As the polishing continues, slurry is removed from shallower depths in order to pull finer grit from the slurry. When the polishing is complete, the flow in the delivery pipe is ceased. The flow of slurry in the bypass pipe is resumed to start agitating the slurry. In another embodiment, the multiple intake pipes are replaced by a single adjustable pipe. As the slurry is settling, the pipe is moved upward to remove the finer grit near the top of the slurry tank as the polishing process continues.
STATEMENT OF RIGHTS OF INVENTION
The United States Government has rights in this invention pursuant to Contract No. W-7405-ENG-48 between the United States Department of Energy and the University of California.