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MgO buffer layers on rolled nickel or copper as superconductor substrates

United States Patent

July 17, 2001
View the Complete Patent at the US Patent & Trademark Office
Oak Ridge National Laboratory - Visit the Partnerships Directorate Website
Buffer layer architectures are epitaxially deposited on biaxially-textured rolled-Ni and/or Cu substrates for high current conductors, and more particularly buffer layer architectures such as MgO/Ag/Pt/Ni, MgO/Ag/Pd/Ni, MgO/Ag/Ni, MgO/Ag/Pd/Cu, MgO/Ag/Pt/Cu, and MgO/Ag/Cu. Techniques used to deposit these buffer layers include electron beam evaporation, thermal evaporation, rf magnetron sputtering, pulsed laser deposition, metal-organic chemical vapor deposition (MOCVD), combustion CVD, and spray pyrolysis.
Paranthaman; Mariappan (Knoxville, TN), Goyal; Amit (Knoxville, TN), Kroeger; Donald M. (Knoxville, TN), List, III; Frederic A. (Andersonville, TN)
UT-Battelle, LLC (Oak Ridge, TN)
09/ 096,558
June 12, 1998
The United States Government has rights in this invention pursuant to contract no. DE-AC05-96OR22464 between the United States Department of Energy and Lockheed Martin Energy Research Corporation.