A fluid flow plate is preferably formed with three initial sections, for instance, two layers of conductive (e.g., metal) fibers and a barrier material (e.g., metal foil) which is interposed between the two layers. For example, sintering of these three sections can provide electrical path(s) between outer faces of the two layers. Then, the sintered sections can be, for instance, placed in a mold for forming of flow channel(s) into one or more of the outer faces. Next, rigidizing material (e.g., resin) can be injected into the mold, for example, to fill and/or seal space(s) about a conductive matrix of the electrical path(s). Preferably, abrading of surface(s) of the outer face(s) serves to expose electrical contact(s) to the electrical path(s).