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Process for protecting bonded components from plating shorts

United States Patent

6,051,493
April 18, 2000
View the Complete Patent at the US Patent & Trademark Office
Lawrence Livermore National Laboratory - Visit the Industrial Partnerships Office Website
A method which protects the region between a component and the substrate onto which the components is bonded using an electrically insulating fillet of photoresist. The fillet protects the regions from subsequent plating with metal and therefore shorting the plated conductors which run down the sides of the component and onto the substrate.
Tarte; Lisa A. (Livermore, CA), Bonde; Wayne L. (Pleasanton, CA), Carey; Paul G. (Mountain View, CA), Contolini; Robert J. (Pleasanton, CA), McCarthy; Anthony M. (Menlo Park, CA)
The Regents of the University of California (Oakland, CA)
08/ 323,410
October 14, 1994
The United States Government has rights in this invention pursuant to Contract No. W-7405-ENG-48 between the United States Department of Energy and the University of California for the operation of Lawrence Livermore National Laboratory.