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Process for metallization of a substrate by irradiative curing of a catalyst applied thereto

United States Patent

5,989,653
November 23, 1999
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
An improved additive process for metallization of substrates is described whereby a catalyst solution is applied to a surface of a substrate. Metallic catalytic clusters can be formed in the catalyst solution on the substrate surface by irradiating the substrate. Electroless plating can then deposit metal onto the portion of the substrate surface having metallic clusters. Additional metallization thickness can be obtained by electrolytically plating the substrate surface after the electroless plating step.
Chen; Ken S. (Albuquerque, NM), Morgan; William P. (Albuquerque, NM), Zich; John L. (Albuquerque, NM)
Sandia Corporation (Albuquerque, NM)
08/ 986,379
December 8, 1997
This invention was made with Government support under Contract DE-AC04-94AL85000 awarded by the U.S. Department of Energy. The Government has certain rights in the invention.