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Automated defect spatial signature analysis for semiconductor manufacturing process

United States Patent

5,982,920
November 9, 1999
View the Complete Patent at the US Patent & Trademark Office
Oak Ridge National Laboratory - Visit the Partnerships Directorate Website
An apparatus and method for performing automated defect spatial signature alysis on a data set representing defect coordinates and wafer processing information includes categorizing data from the data set into a plurality of high level categories, classifying the categorized data contained in each high level category into user-labeled signature events, and correlating the categorized, classified signature events to a present or incipient anomalous process condition.
Tobin, Jr.; Kenneth W. (Harriman, TN), Gleason; Shaun S. (Knoxville, TN), Karnowski; Thomas P. (Knoxville, TN), Sari-Sarraf; Hamed (Knoxville, TN)
Lockheed Martin Energy Research Corp. Oak Ridge National Laboratory (Oak Ridge, TN)
08/ 780,569
January 8, 1997
This invention was made with government support under Contract No. DE-AC05-840R21400 awarded by the U.S. Department of Energy to Lockheed Marietta Energy Systems, Inc. and the government has certain rights in this invention.