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Method for making high-critical-current-density YBa.sub.2 Cu.sub.3 O.sub.7 superconducting layers on metallic substrates

United States Patent

5,972,847
October 26, 1999
View the Complete Patent at the US Patent & Trademark Office
Oak Ridge National Laboratory - Visit the Partnerships Directorate Website
A method is disclosed for fabricating YBa.sub.2 Cu.sub.3 O.sub.7 superconductor layers with the capability of carrying large superconducting currents on a metallic tape (substrate) supplied with a biaxially textured oxide buffer layer. The method represents a simplification of previously established techniques and provides processing requirements compatible with scale-up to long wire (tape) lengths and high processing speeds. This simplification has been realized by employing the BaF.sub.2 method to grow a YBa.sub.2 Cu.sub.3 O.sub.7 film on a metallic substrate having a biaxially textured oxide buffer layer.
Feenstra; Roeland (Knoxville, TN), Christen; David (Oak Ridge, TN), Paranthaman; Mariappan (Knoxville, TN)
Lockheed Martin Energy (Oak Ridge, TN)
09/ 014,481
January 28, 1998
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT The U.S. Government has rights in this invention pursuant to contract number DE-AC O5-96OR22464 between the United States Department of Energy (DOE) and Lockheed Martin Energy Research Corporation. The invention was funded by the Superconductivity Program for Electric Power Systems, DOE Office of Energy Efficiency and Renewable Energy, and the DOE Office of Energy Research.