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Temperature measuring device

United States Patent

5,969,639
October 19, 1999
View the Complete Patent at the US Patent & Trademark Office
U.S. Department of Energy - Visit the Office of the Assistant General Counsel for Technology Transfer & Intellectual Property Website
Systems and methods are described for a wireless instrumented silicon wafer that can measure temperatures at various points and transmit those temperature readings to an external receiver. The device has particular utility in the processing of semiconductor wafers, where it can be used to map thermal uniformity on hot plates, cold plates, spin bowl chucks, etc. without the inconvenience of wires or the inevitable thermal perturbations attendant with them.
Lauf; Robert J. (Oak Ridge, TN), Bible; Don W. (Clinton, TN), Sohns; Carl W. (Oak Ridge, TN)
Lockheed Martin Energy Research Corporation (Oak Ridge, TN)
08/ 901,708
July 28, 1997
STATEMENT AS TO RIGHTS TO INVENTIONS MADE UNDER FEDERALLY-SPONSORED RESEARCH AND DEVELOPMENT This invention was made with United States government support awarded by the United States Department of Energy under contract to Lockheed Martin Energy Research Corporation. The United States has certain rights in this invention.