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Electronic circuits having NiAl and Ni.sub.3 Al substrates

United States Patent

5,965,274
October 12, 1999
View the Complete Patent at the US Patent & Trademark Office
Oak Ridge National Laboratory - Visit the Partnerships Directorate Website
An electronic circuit component having improved mechanical properties and thermal conductivity comprises NiAl and/or Ni.sub.3 Al, upon which an alumina layer is formed prior to applying the conductive elements. Additional layers of copper-aluminum alloy or copper further improve mechanical strength and thermal conductivity.
Deevi; Seetharama C. (Midlothian, VA), Sikka; Vinod K. (Oak Ridge, TN)
Lockheed Martin Energy Research Corporation (Oak Ridge, TN)
08/ 969,665
November 13, 1997
The United States Government has rights in this invention pursuant to contract no. DE-AC05-84OR21400 between the United States Department of Energy and Lockheed Martin Energy Systems, Inc.