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Apparatus and method for selective area deposition of thin films on electrically biased substrates

United States Patent

5,910,220
June 8, 1999
View the Complete Patent at the US Patent & Trademark Office
Oak Ridge National Laboratory - Visit the Partnerships Directorate Website
An ion beam deposition process for selective area deposition on a polarized substrate uses a potential applied to the substrate which allows the ionized particles to reach into selected areas for film deposition. Areas of the substrate to be left uncoated are held at a potential that repells the ionized particles.
Zuhr; Raymond A. (Oak Ridge, TN), Haynes; Tony E. (Knoxville, TN), Golanski; Andrzej (Le Cheylas, FR)
Martin Marietta Energy Systems, Inc. (Oak Ridge, TN)
08/ 286,371
August 5, 1994
This invention was made with Government support under contract DE-AC05-840R21400 awarded by the U.S. Department of Energy to Martin Marietta Energy Systems, Inc. and the Government has certain rights in this invention.