A semiconductor assembly includes a semiconductor wafer including backside contact pads coupled to respective contact regions of different signal types and insulation separating the backside contact regions by signal type. The semiconductor assembly further includes metallization situated over at least a portion of the insulation and interconnecting the backside contact pads.
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH & DEVELOPMENT
 This invention was made with Government support under contract number DE-AC36-99GO10337 awarded by the United States Department of Energy. The Government has certain rights in the invention.