Skip to Content
Find More Like This
Return to Search

Chamberless Plasma Deposition of Coatings

United States Patent Application

20080014445
A1
View the Complete Application at the US Patent & Trademark Office
A system and method of depositing coatings on a substrate includes providing a substrate in contact with air, and providing a plasma source (12) having a housing (16) surrounding a first electrode (18) and a second electrode (20) spaced from the first electrode. A plasma is generated by applying a signal to the first electrode and exciting a gas between the first electrode and the second electrode. A substantially uniform flux of at least one reactive specie is generated over an area larger than 1 cm.sup.2. The plasma is emitted into the air and toward the substrate. Various embodiments of the system and method allow high speed deposition of coatings on even thermally-sensitive substrates without the need of a chamber enclosing the substrate.
Hicks, Robert F. (Los Angeles, CA), Nowling, Gregory R. (San Jose, CA)
The Regents of the University of California (1111 Franklin Street, 12th Floor Oakland CA 94607)
11/ 571,238
June 24, 2005
ACKNOWLEDGEMENT OF GOVERNMENT SUPPORT [0002] This invention was made with government support under grant no. DE-FG07-00ER45857, awarded by the Department of Energy, and grant no. CTS-9821062, awarded by the National Science Foundation. The Government has certain rights in the invention.