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Panel molding method and apparatus

United States Patent Application

20070090554
A1
View the Complete Application at the US Patent & Trademark Office
A method and apparatus for molding panels, the apparatus including upper and lower mold dies, a sprayer that sprays resin onto the lower mold die, and a wiper seal ring that's disposed in a position to form a vacuum chamber between the upper and lower mold dies as the mold dies are moving together from an initial sealing position to a closed position. A vacuum source draws air from the vacuum chamber as the mold dies are closing. The vacuum draws trapped air from within the sprayed-on resin to provide a superior class-A surface.
Wykoff, Rick (Commerce, MI), Houston, Dan (Dearborn, MI), Staniszewski, Stan (Grosse Pointe Woods, MI), Cooper, Ron (Canton, MI), Berger, Elisabeth (Farmington Hills, MI), Iobst, Stanley (Troy, MI)
11/ 259,479
October 26, 2005
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT [0001] The U.S. government has a paid-up license in this invention and the right in limited circumstances to require the patent owner to license others on reasonable terms as provided for by the terms of Cooperative Agreement No. DE-FC05-02-OR22910 awarded by the Department of Energy.