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United States Patent Application

View the Complete Application at the US Patent & Trademark Office
A multi-layer metal core printed circuit board (MCPCB) has mounted on it at least one or more heat-generating LEDs and one or more devices configured to provide current to the one or more LEDs. The one or more devices may include a device that carries a steep slope voltage waveform. Since there is typically a very thin dielectric between the patterned copper layer and the metal substrate, the steep slope voltage waveform may produce a current in the metal substrate due to AC coupling via parasitic capacitance. This AC-coupled current may produce electromagnetic interference (EMI). To reduce the EMI, a local shielding area may be formed between the metal substrate and the device carrying the steep slope voltage waveform. The local shielding area may be conductive and may be electrically connected, to a DC voltage node adjacent to the one or more devices.
Song, Zhihua (San Jose, CA), Soer, Wouter (San Jose, CA), Bonne, Ron (San Jose, CA), Qiu, Yifeng (San Jose, CA)
Lumileds LLC (San Jose CA)
15/ 587,567
May 5, 2017
GOVERNMENT LICENSE RIGHTS [0002] This invention was made with U.S. Government support under Contract No. DE-EE0006703 awarded by the Department of Energy (DOE). The Government has certain rights in this invention.