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Lubricated mechanical polishing

United States Patent Application

20170239780
A1
View the Complete Application at the US Patent & Trademark Office
A lubricated mechanical polishing (LMP) process is provided that uses hard nanoparticles of less than 5 nm diameter dispersed in a fluid lubricant as a polishing slurry to produce an ultra-smooth surface on a hard metallic or non-metallic substrate with a sub-nanometer surface roughness substantially less than that produced by silica chemical mechanical polishing.
Cademartiri, Ludovico (Ames, IA), Montoya, Briane Caroline (Denver, CO)
Iowa State University Research Foundation, Inc.
15/ 530,575
January 31, 2017
CONTRACTUAL ORIGIN OF THE INVENTION [0002] This invention was made with government support under Grant No. DE-AC02-07CH11358 awarded by the U.S. Department of Energy. The government has certain rights in the invention.