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Thermoelectric Generator To Engine Exhaust Manifold Interface Using A Direct-Bond-Copper (DBC) Arrangement

United States Patent Application

20170098750
A1
View the Complete Application at the US Patent & Trademark Office
An assembly for coupling thermally a thermoelectric generator (TEG) to an exhaust manifold includes a first heat-exchanger, a first dielectric-layer, a TEG, and a direct-bond-copper-arrangement (DBC). The first dielectric-layer overlies a portion of the outer surface of the first heat-exchanger. The first dielectric-layer is formed by firing a thick-film dielectric material onto the stainless steel of the first heat-exchanger. The TEG defines a first contact suitable to be coupled thermally and electrically to the first conductor-layer. The DBC is interposed between the first dielectric-layer and the first contact of the TEG. The DBC is formed by an adhesion-layer formed of high-adhesion-copper-thick-film in contact with the first dielectric-layer, a bond-layer formed of copper-thick-film that overlies and is in contact with the adhesion-layer opposite the first-dielectric-layer, and a copper-foil-layer that overlies and is in contact with the bond-layer opposite the adhesion-layer.
Berlin, Carl W. (Chamberlain, SD), Brandenburg, Scott D. (Kokomo, IN), Myers, Bruce A. (Kokomo, IN)
14/ 873,763
October 2, 2015
STATEMENT REGARDING GOVERNMENT SPONSORED DEVELOPMENT [0001] This invention was made with United States Government support under Government Contract/Purchase Order Number DE-EE0005432 awarded by the Department of Energy. The Government has certain rights in this invention.