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HIGH VOLTAGE POWER MODULE

United States Patent Application

20170112005
A1
View the Complete Application at the US Patent & Trademark Office
A power module includes a number of sub-modules connected via removable jumpers. The removable jumpers allow the connections between one or more power semiconductor die in the sub-modules to be reconfigured, such that when the removable jumpers are provided, the power module has a first function and when the removable jumpers are removed, the power module has a second function. The removable jumpers may also allow for independent testing of the sub-modules. The power module may also include a multi-layer printed circuit board (PCB), which is used to connect one or more contacts of the power semiconductor die. The multi-layer PCB reduces stray inductance between the contacts and therefore improves the performance of the power module.
Cole, Zachary (Summers, AR), Passmore, Brandon (Fayetteville, AR)
14/ 918,110
October 20, 2015
GOVERNMENT SUPPORT [0001] This invention was made with government funds under contract number N00014-15-C-0051 awarded by the Department of Energy. The U.S. Government has certain rights in this invention.