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HIGH-DENSITY, FAIL-IN-PLACE SWITCHES FOR COMPUTER AND DATA NETWORKS

United States Patent Application

20170155598
A1
View the Complete Application at the US Patent & Trademark Office
A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.
Coteus, Paul W. (Yorktown, NY), Doany, Fuad E. (Katonah, NY), Hall, Shawn A. (Pleasantville, NY), Schultz, Mark D. (Ossining, NY), Takken, Todd E. (Brewster, NY), Tian, Shurong (Mount Kisco, NY)
15/ 430,574
February 13, 2017
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT [0001] This invention was made with United States Government support under contract B601996 awarded by U.S. Department of Energy. The Government has certain rights to this invention.