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LAMINATED MAGNETIC MATERIALS FOR ON-CHIP MAGNETIC INDUCTORS/TRANSFORMERS

United States Patent Application

20170076860
A1
View the Complete Application at the US Patent & Trademark Office
A technique relates to a method of forming a laminated multilayer magnetic structure. An adhesion layer is deposited on a substrate. A magnetic seed layer is deposited on top of the adhesion layer. Magnetic layers and non-magnetic spacer layers are alternatingly deposited such that an even number of the magnetic layers is deposited while an odd number of the non-magnetic spacer layers is deposited. The odd number is one less than the even number. Every two of the magnetic layers is separated by one of the non-magnetic spacer layers. The first of the magnetic layers is deposited on the magnetic seed layer, and the magnetic layers each have a thickness less than 500 nanometers.
Deligianni, Hariklia (Alpine, NJ), Gallagher, William J. (Ardsley, NY), Kitayaporn, Sathana (Portland, OR), O'Sullivan, Eugene J. (Nyack, NY), Romankiw, Lubomyr T. (Briancliff Manor, NY), Wang, Naigang (Ossining, NY), Yoon, Joonah (Fishkill, NY)
14/ 950,364
November 24, 2015
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT [0002] This invention was made with Government support under University of California Subcontract B601996 awarded by the Department of Energy. The Government has certain rights to this invention.