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Photocathode and Method for Assembly

United States Patent Application

View the Complete Application at the US Patent & Trademark Office
Lawrence Berkeley National Laboratory - Visit the Technology Transfer and Intellectual Property Management Department Website
Technologies are described for methods for fabricating a film component. The methods may comprise sputtering a first film onto a substrate. The first film may include a semiconductor compound material. The semiconductor compound material may include a semi-metal material and one or more alkali material. The methods may further comprise evaporating a second film onto the first film. The second film may include the one or more alkali materials. The one or more alkali materials may catalyze crystallization of the semiconductor compound material in the first film substantially throughout the first film to form the film component in the first layer.
Smedley, John (Shirley, NY), Attenkofer, Klaus (Riverhead, NY), Schubert, Susanne (San Mateo, CA), Gaowei, Mengjia (Port Jefferson Station, NY), Walsh, John (Sound Beach, NY)
15/ 179,091
June 10, 2016
STATEMENT OF GOVERNMENT RIGHTS [0002] The present invention was made with government support under contract numbers DE-SC0012704 and DE-AC02-05CH11231 awarded by the U.S. Department of Energy. The United States government may have certain rights in this invention.