Skip to Content
Find More Like This
Return to Search

INTEGRATED PACKAGING OF MULTIPLE DOUBLE SIDED COOLING PLANAR BOND POWER MODULES

United States Patent Application

20160351468
A1
View the Complete Application at the US Patent & Trademark Office
Oak Ridge National Laboratory - Visit the Partnerships Directorate Website
An integrated double sided cooled power module has one or multiple phase legs configuration including one or more planar power packages, each planar power package having an upper power switch unit and a lower power switch unit directly bonded and interconnected between two insulated power substrates, and further sandwiched between two heat exchangers via direct bonds. A segmented coolant manifold is interposed with the one or more planar power packages and creates a sealed enclosure that defines a coolant inlet, a coolant outlet and a coolant flow path between the inlet and the outlet. A coolant circulates along the flow path to remove heat and increase the power density of the power module.
Liang, Zhenxian (Knoxville, TN)
15/ 159,860
May 20, 2016
STATEMENT REGARDING FEDERALLY FUNDED RESEARCH AND DEVELOPMENT [0003] This invention was made with government support under Contract No. DE-AC05-00OR22725 between UT-Battelle, LLC. and the U.S. Department of Energy. The government has certain rights in the invention.