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HIGH FLUX DIODE PACKAGING USING PASSIVE MICROSCALE LIQUID-VAPOR PHASE CHANGE

United States Patent Application

*** PATENT GRANTED ***
20160315445
9,768,584
A1
View the Complete Application at the US Patent & Trademark Office
Lawrence Livermore National Laboratory - Visit the Industrial Partnerships Office Website
A laser diode package includes a heat pipe having a fluid chamber enclosed in part by a heat exchange wall for containing a fluid. Wicking channels in the fluid chamber is adapted to wick a liquid phase of the fluid from a condensing section of the heat pipe to an evaporating section of the heat exchanger, and a laser diode is connected to the heat exchange wall at the evaporating section of the heat exchanger so that heat produced by the laser diode is removed isothermally from the evaporating section to the condensing section by a liquid-to-vapor phase change of the fluid.
Bandhauer, Todd (Livermore, CA), Deri, Robert J. (Pleasanton, CA), Elmer, John W. (Danville, CA), Kotovsky, Jack (Alameda, CA), Patra, Susant (Brentwood, CA)
15/ 080,507
March 24, 2016
FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT [0002] The United States Government has rights in this invention pursuant to Contract No. DE-AC52-07NA27344 between the United States Department of Energy and Lawrence Livermore National Security, LLC for the operation of Lawrence Livermore National Laboratory.