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Reversible Adhesive Compositions and Related Methods

United States Patent Application

View the Complete Application at the US Patent & Trademark Office
The disclosure relates to reversible bonded structural joints using active adhesive compositions that can allow for dis-assembly, repair, and re-assembly. The disclosure is particularly directed to the adhesive composition material, irrespective of the type of the substrate(s) being joined. The adhesive composition can include any thermoplastic adhesive material that can be remotely activated for targeted heating of just the adhesive composition (e.g., and not the surrounding substrates being joined) via the inclusion of electromagnetically excitable particles in the adhesive composition. The substrates can be any metal material, any composite material, any hybrid material, or otherwise. The disclosed adhesive compositions allow for recyclability of parts at the end of their lifetime and repair/replacement of parts during their lifetime.
Haq, Mahmoodul (Lansing, MI), Drzal, Lawrence T. (Okemos, MI), Koricho, Ermias G. (Okemos, MI)
15/ 078,333
March 23, 2016
STATEMENT OF GOVERNMENT INTEREST [0002] This invention was made with government support under DE-EE0006424 awarded by the U.S. Department of Energy. The government has certain rights in the invention.