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HEAT DISSIPATION ASSEMBLY

United States Patent Application

20160268180
A1
View the Complete Application at the US Patent & Trademark Office
A heat dissipating assembly including a layered stack of materials with a highly thermally conductive path for cooling a circuit, the stack including a structurally isolated material having a high coefficient of thermal expansion connected between materials having low coefficients of thermal expansion.
JOHNSON, MATTHEW (OVERLAND PARK, KS)
HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC (KANSAS CITY MO)
15/ 159,275
May 19, 2016
GOVERNMENT INTERESTS [0002] The present invention was developed with support from the U.S. government under a contract with the United States Department of Energy, Contract No. DE-NA0000622. Accordingly, the U.S. government has certain rights in the present invention.