A method includes determining a relationship between indirect thermal data for a processor and a measured temperature associated with the processor, during a calibration process, obtaining the indirect thermal data for the processor during actual operation of the processor, and determining an actual significant temperature associated with the processor during the actual operation using the indirect thermal data for the processor during actual operation of the processor and the relationship.
 This invention was made with Government support under Contract No.: DE-EE0002894 (awarded by Department of Energy (DOE)). The Government has certain rights in this invention. Furthermore, this patent application is a divisional of U.S. patent application Ser. No. 13/691,145 filed Nov. 30, 2012, entitled "CALIBRATING THERMAL BEHAVIOR OF ELECTRONICS." The complete disclosure of the aforementioned U.S. patent application Ser. No. 13/691,145 is expressly incorporated herein by reference in its entirety for all purposes.