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United States Patent Application

View the Complete Application at the US Patent & Trademark Office
An array of housings with housing bodies and lenses is molded, or an array of housing bodies is molded and bonded with lenses to form an array of housings with housing bodies and lenses. Light-emitting diodes (LEDs) are attached to the housings in the array. An array of metal pads may be bonded to the back of the array or insert molded with the housing array to form bond pads on the back of the housings. The array is singulated to form individual LED modules.
Bierhuizen, Serge J. (Santa Rosa, CA), Wang, Nanze Patrick (San Jose, CA), Eng, Gregory W. (Fremont, CA), Sun, Decai (Los Altos, CA), Wei, Yajun (Sunnyvale, CA)
15/ 077,255
March 22, 2016
STATEMENT OF GOVERNMENT SPONSORED RESEARCH [0002] One or more embodiments of this invention were made with Government support under contract no. DE-FC26-08NT01583 awarded by Department of Energy. The Government has certain rights in this invention.