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HIGH TEMPERATURE VIBRATION RESISTANT SOLDERLESS ELECTRICAL CONNECTIONS FOR PLANAR SURFACES

United States Patent Application

20160181707
A1
View the Complete Application at the US Patent & Trademark Office
An electrical arrangement (10), including: a first conductor (12) having a first generally planar contact area (34); a second conductor (12) having a second generally planar contact area (40); an intermediate conductor (44) having a first faying area (84) overlying the first contact area and a second faying area (86) overlying the second contact area; a compression arrangement configured to compress the first faying area and the first contact area toward each other and to compress the second faying area and the second contact area toward each other; and a dimpling structure (46) effective to create plural contact points (74) between the first faying area and the first contact area and between the second faying area and the second contact area when the first and the second faying areas and the first and second contact areas are compressed toward each other by the compression arrangement.
McConkey, Joshua S. (Orlando, FL)
14/ 576,365
December 19, 2014
STATEMENT REGARDING FEDERALLY SPONSORED DEVELOPMENT [0001] Development for this invention was supported in part by Contract No. DE-FE0005666, awarded by the United States Department of energy. Accordingly, the United States Government may have certain rights in this invention.