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CERAMIC DIELECTRIC FILMS, METHOD FOR MAKING CERAMIC DIELECTRIC FILMS

United States Patent Application

20160153084
A1
View the Complete Application at the US Patent & Trademark Office
The invention provides a dielectric-conductive substrate construct comprising a conductive material having a first surface and a second surface, and a dielectric film directly contacting the first surface and substantially covering the first surface, wherein the second surface is exposed to the ambient environment. Also provided is a method for producing a two component dielectric-conductive substrate, the method comprising supplying a base metal; and directly contacting a ceramic to the base metal to form a ceramic-metal interface while simultaneously preventing the formation of electrically insulative layers at the interface.
Ma, Beihai (Naperville, IL), Balachandran, Uthamalingam (Willowbrook, IL), Dorris, Stephen E. (LaGrange Park, IL), Lee, Tae H. (Naperville, IL)
UCHICAGO ARGONNE, LLC (Chicago IL)
14/ 489,153
September 17, 2014
CONTRACTUAL ORIGIN OF THE INVENTION [0001] The U.S. Government has rights in this invention pursuant to Contract No. DE-AC02-06CH11357 between the U.S. Department of Energy and UChicago Argonne, LLC, representing Argonne National Laboratory.