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USE OF SILICON NITRIDE AS A SUBSTRATE AND A COATING MATERIAL FOR THE RAPID SOLIDIFICATION OF SILICON

United States Patent Application

20160141442
A1
View the Complete Application at the US Patent & Trademark Office
Silicon nitride particles are used as a coating or substrate material for kerfless wafer making technologies.
Sachs, Christoph (Herzogenrath, DE)
14/ 900,884
July 10, 2014
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT [0002] This invention was made with Government support under Prime Contract No. DE-FG36-08GO18008, awarded by the Department of Energy. The Government has certain rights in this invention.