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ALUMINUM DEPOSITION DEVICES AND THEIR USE IN SPOT ELECTROPLATING OF ALUMINUM

United States Patent Application

*** WITHDRAWN ***
20160108534
A1
View the Complete Application at the US Patent & Trademark Office
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A method for spot electroplating aluminum onto a metallic substrate without submersion or dipping of the metallic substrate in an electroplating bath, the method comprising: (i) spot coating said metallic substrate with an aluminum ion-containing electrolyte contained within a protective structure possessing at least one aperture, and releasing said electrolyte from said at least one aperture onto said metallic substrate to form a coating of said electrolyte thereon, wherein said electrolyte is in contact with an anode; and (ii) applying a voltage potential between the anode and metallic substrate polarized as cathode when the aluminum ion-containing electrolyte is released from said aperture and forms a coating on the metallic substrate, to produce a coating of aluminum on the substrate. Devices, such as brush and ball pen plating devices, for achieving the above-described method are also described.
Dai, Sheng (Knoxville, TN), Sun, Xiao-Guang (Knoxville, TN), Hussey, Charles L. (Oxford, MS), Chou, Li-Hsien (Oxford, MS)
14/ 516,608
October 17, 2014
[0001] This invention was made with government support under Prime Contract No. DE-AC05-00OR22725 awarded by the U.S. Department of Energy. The government has certain rights in the invention.