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United States Patent Application

View the Complete Application at the US Patent & Trademark Office
One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.
ABAS, Emmanuel Chua (Laguna, PH), CHEN, Chen-An (Milpitas, CA), MA, Diana Xiaobing (Saratoga, CA), GANTI, Kalyana Bhargava (Fremont, CA), DIVINO, Edmundo Anida (Cavite, PH), ERMITA, Jake Randal G. (Laguna, PH), CAPULONG, Jose Francisco S. (Laguna, PH), CASTILLO, Arnold Villamor (Laguna, PH)
SunPower Corporation (San Jose CA)
14/ 957,259
December 2, 2015
STATEMENT OF FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT [0002] The invention described herein was made with Governmental support under contract number DE-FC36-07GO17043 awarded by the United States Department of Energy. The Government may have certain rights in the invention.