Methods for forming silicon thin films and structures with incorporated metals, non-metals, and combinations thereof, liquid precursor compositions useful in such methods, and silicon thin films and structures with embedded heteroatom(s) are described. The compositions are generally liquid at ambient temperature and are comprised of liquid silane(s) and have metal and/or non-metal additives. Metal and non-metal sources include organometallic and organic compounds, respectively. The compositions may also contain a solvent. The compositions may be processed by printing, coating, or spraying onto a substrate and subjected to UV, thermal, IR, and/or laser treatment to form silicon films or structures with embedded heteroatom(s).
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
 This invention was made with Government support under DE-FG36-08G088160 awarded by the United States Department of Energy. The Government has certain rights in the invention.