A hermetic electronics package of a multi-electrode neural prosthesis system includes a metal case, a feedthrough construction having an electrically insulating substrate and an array of electrically conductive feedthroughs extending through it, with the electrically insulating substrate connected to the open end of the metal case to form a hermetically sealed enclosure. And a set of electronic components is located within the hermetically sealed enclosure and operably connected to the feedthroughs of the feedthrough construction so as to electrically communicate outside the package. And a demultiplexer is fsoperatively connected to demultiplex a single signal into multiple signals prior to being transmitted through the feedthroughs.
FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
 The United States Government has rights in this invention pursuant to Contract No. DE-AC52-07NA27344 between the United States Department of Energy and Lawrence Livermore National Security, LLC for the operation of Lawrence Livermore National Laboratory.